Description
TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil,
which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
| P/N | CL-O023-GROSGM-A |
|---|---|
| THERMAL CONDUCTIVITY | 4.5 W/m-k |
| COLOR | Gray |
| WEIGHT | 4g |
| VISCOSITY | 76 Pa-s |
| THERMAL IMPEDANCE | 0.185°C -in²/W |
| DENSITY | 2.55 g/cm³ |
Additional Information
LGA: |
2066 |
LGA: |
2011 |
LGA: |
1366 |
LGA: |
1200 |
LGA: |
1156 |
LGA: |
1155 |
LGA: |
1151 |
LGA: |
1150 |
