Cooler Master CryoNAMIC Phase Change Material Thermal Pad 40×30×0.2 mm | TPY-ADPG-3040-R1

The Cooler Master CryoNAMIC Phase Change Thermal Pad provides exceptional thermal conductivity through advanced phase-change material technology. Designed to fill microscopic gaps between CPU, GPU, or heatsink surfaces, it delivers long-term stable performance without the mess of traditional thermal paste. Once the system reaches operating temperature, the pad softens and spreads evenly for efficient heat transfer.

Key Features:

• Model: TPY-ADPG-3040-R1
• Material Type: Phase Change Material (PCM)
• Thermal Conductivity: ~12 W/m·K (typical)
• Dimensions: 40 × 30 × 0.2 mm
• Operating Temperature Range: −50 °C to 200 °C
• Reusable & Non-Corrosive: Safe for all metal surfaces
• Ideal Applications: CPUs, GPUs, VRMs, and power modules
• Manufacturer: Cooler Master
• Benefits:
  • Easy to apply – no need for paste spreading or curing time
  • Stable performance across multiple heat cycles
  • Electrically non-conductive and durable under pressure